High Density Plus® (HD+) connectors from Winchester are an all-inclusive backplane connector system that consist of signal, power, guide, and polarization modules that are sold individually. The daughter card modules are mounted onto an extruded aluminum stiffener and sold as “stiffener assemblies.” The ability to stack a variety of modules next to one another allows OEM designers to create custom connector configurations using standard off-the-shelf components. Contact centerline spacing for HD+ signal modules is a .100 x .100 inch grid. Backplane pin connectors are less likely to be damaged during assembly, handling, and mating than many of today’s higher density backplane connector systems as they contain robust .025 square inch pins. Backplane pin connectors are available in solder tail or C-Press® compliant pin technology. Signal modules are available as 3- or 4-row modules with either 15 or 20 positions per row.

Signal modules can be supplied with 1 or 2 additional contact rows for applications that require improved electrical performance.This help to:

• Minimize reflections due to impedance mismatches.
• Reduce cross talk between adjacent signal contacts.
• Minimize inductance of contacts used for power and ground.
• Integrate power distribution into the backplane.