4 Contact Row High Density Signal Connectors

• Offset-grid contact layout, four contact rows within dielectric connector body, 1.905 mm center-to-center contact spacing in each row and 1.905 row-to-row spacing.
• 0.6 mm nominal pin DIA contact size; 42 to 316 contact positions; dip solder and SMT soldering contact termination types.
• High contact density, low connector weight, low mating force. High shock and vibration proof (no micro interruptions - test: 2ns).
• Conforms to MIL-DTL-55302 general requirements, and TPR 02013. CSD conforms to ESA specification.
• For Civil, Military, Aerospace and Space applications.