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HyperSpring® from Hypertac combines the mechanical feature of the spring with the electrical performance of the hyperboloid contact, to produce interconnections with improved signal integrity, high reliability and current density, and proven parametric stability over time.
The spring itself, in a HyperSpring connector, is not used for electrical conduction. Instead, a Hypertac socket placed between the barrel and the plunger of a common spring-loaded contact handles this. This means that the material used to form the spring may be chosen solely on the basis of its mechanical properties: primarily its elasticity. As a result it is possible to optimise the physical performance of the overall system, achieving, for instance, much higher probing speeds than would otherwise be possible.
- Spring loaded contact with Hyperboloid socket
- Available with Hypertac Coax, Power and Signal Contact
- Suitable for low height PCB Interconnect, and high density applications
- Provides cleaning contact action on harsh connection environment
- Provides reliable connection: mechanical provided by internal spring and electrical provided by internal pin and socket mating
- Easy replacement and maintenance
- Connection test system for microchip wafer testing
- Suitable for Medical, Military, Defence, and Test & Measurement Markets
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